Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745427 | Hybrid additive-subtractive laser fabrication platform for shaping hydrogels | Pranav Soman, Puskal Kunwar | 2023-09-05 |
| 11260596 | Hybrid additive-subtractive laser fabrication platform for shaping hydrogels | Pranav Soman, Puskal Kunwar | 2022-03-01 |
| 7776648 | High thermal performance packaging for circuit dies | Kok Hua Chua, Budi Njoman | 2010-08-17 |