Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058712 | Device having wire bond and redistribution layer | Mitchell M. Hamamoto, Yi Gao Chen | 2011-11-15 |
| 7541251 | Wire bond and redistribution layer process | Mitchell M. Hamamoto, Yioao Chen | 2009-06-02 |
| 7462942 | Die pillar structures and a method of their formation | Ch'ng Han Shen, Rosemarie Tagapulot, Yin Yen Bong, Ma L. Nang Htoi, Lim Tiong Soon +2 more | 2008-12-09 |
| 6550666 | Method for forming a flip chip on leadframe semiconductor package | Jimmy Chew | 2003-04-22 |
| 6319450 | Encapsulated circuit using vented mold | Kok Hua Chua, Ching Meng Fang | 2001-11-20 |
| 6199464 | Method and apparatus for cutting a substrate | Kok Hua Chua, JinHan Ju | 2001-03-13 |