Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7462942 | Die pillar structures and a method of their formation | Kim Hwee Tan, Ch'ng Han Shen, Rosemarie Tagapulot, Ma L. Nang Htoi, Lim Tiong Soon +2 more | 2008-12-09 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2004-02-03 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-09-17 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-06-04 |