| 6963124 |
Locking of mold compound to conductive substrate panels |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2005-11-08 |
| 6933174 |
Leadless leadframe package design that provides a greater structural integrity |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2005-08-23 |
| 6818970 |
Leadless leadframe package design that provides a greater structural integrity |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2004-11-16 |
| 6808961 |
Locking of mold compound to conductive substrate panels |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2004-10-26 |
| 6686652 |
Locking lead tips and die attach pad for a leadless package apparatus and method |
Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more |
2004-02-03 |
| 6677667 |
Leadless leadframe package design that provides a greater structural integrity |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2004-01-13 |
| 6674156 |
Multiple row fine pitch leadless leadframe package with use of half-etch process |
Jaime A. Bayan |
2004-01-06 |
| 6617197 |
Multi row leadless leadframe package |
Jaime A. Bayan |
2003-09-09 |
| 6576989 |
Locking of mold compound to conductive substrate panels |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2003-06-10 |
| 6551048 |
Off-load system for semiconductor devices |
Jaime A. Bayan |
2003-04-22 |
| 6483180 |
Lead frame design for burr-free singulation of molded array packages |
Jaime A. Bayan |
2002-11-19 |
| 6452255 |
Low inductance leadless package |
Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more |
2002-09-17 |
| 6448107 |
Pin indicator for leadless leadframe packages |
Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more |
2002-09-10 |
| 6399415 |
Electrical isolation in panels of leadless IC packages |
Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more |
2002-06-04 |
| 6372539 |
Leadless packaging process using a conductive substrate |
Jaime A. Bayan |
2002-04-16 |
| 6348726 |
Multi row leadless leadframe package |
Jaime A. Bayan |
2002-02-19 |
| 5986332 |
Integrated circuit leadframe incorporating overhanging leads |
Chin Seng Chu |
1999-11-16 |
| 5926695 |
Lead frame incorporating material flow diverters |
Chin Seng Chu |
1999-07-20 |
| 5789806 |
Leadframe including bendable support arms for downsetting a die attach pad |
Charlie Kho Chua, Ka-Heng The |
1998-08-04 |
| 5629563 |
Component stacking in multi-chip semiconductor packages |
Hem Takiar, Uli H. Hegel, James L. Crozier, Michelle M. Hou-Chang, Martin A. Delateur |
1997-05-13 |