Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6963124 | Locking of mold compound to conductive substrate panels | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2005-11-08 |
| 6933174 | Leadless leadframe package design that provides a greater structural integrity | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2005-08-23 |
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-10-26 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-01-13 |
| 6629880 | Rotary mechanical buffing method for deflashing of molded integrated circuit packages | Aik Seng Kang, Ah Lek Hu | 2003-10-07 |
| 6576989 | Locking of mold compound to conductive substrate panels | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2003-06-10 |
| 6448107 | Pin indicator for leadless leadframe packages | Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2002-09-10 |