Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7859090 | Die attach method and leadframe structure | Jaime A. Bayan, Nghia Thuc Tu, Lim Fong | 2010-12-28 |
| 7598122 | Die attach method and microarray leadframe structure | Jaime A. Bayan, Nghia Thuc Tu, Lim Fong | 2009-10-06 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package | Jamie A. BAYAN, Ashok S. Prabhu, Hasfiza Ramley, Santhiran Nadarajah | 2007-08-21 |
| 7186588 | Method of fabricating a micro-array integrated circuit package | Jaime A. Bayan, Santhiran Nadarajah, Chan Chee Ling, Ashok S. Prabhu, Hasfiza Ramley | 2007-03-06 |
| 7002239 | Leadless leadframe packaging panel featuring peripheral dummy leads | Santhiran Nadarajah, Sharon Ko Mei Wan | 2006-02-21 |
| 6963124 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2005-11-08 |
| 6933223 | Ultra-low loop wire bonding | Lim Peng Soon | 2005-08-23 |
| 6933174 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2005-08-23 |
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2004-10-26 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2004-01-13 |
| 6576989 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2003-06-10 |
| 6448107 | Pin indicator for leadless leadframe packages | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Jaime A. Bayan +1 more | 2002-09-10 |