Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7186588 | Method of fabricating a micro-array integrated circuit package | Jaime A. Bayan, Santhiran Nadarajah, Ashok S. Prabhu, Hasfiza Ramley, Chan Peng Yeen | 2007-03-06 |
| 7064419 | Die attach region for use in a micro-array integrated circuit package | Jaime A. Bayan, Ashok S. Prabhu, Lye Meng Kong, Santhiran Nadarajah | 2006-06-20 |