Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package | Jamie A. BAYAN, Ashok S. Prabhu, Chan Peng Yeen, Santhiran Nadarajah | 2007-08-21 |
| 7186588 | Method of fabricating a micro-array integrated circuit package | Jaime A. Bayan, Santhiran Nadarajah, Chan Chee Ling, Ashok S. Prabhu, Chan Peng Yeen | 2007-03-06 |