Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package | Ashok S. Prabhu, Chan Peng Yeen, Hasfiza Ramley, Santhiran Nadarajah | 2007-08-21 |