Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2004-02-03 |
| 6629880 | Rotary mechanical buffing method for deflashing of molded integrated circuit packages | Ah Lek Hu, Harry Kam Cheng Hong | 2003-10-07 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-09-17 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-06-04 |