Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7181835 | Universal clamping mechanism | Ah Lek Hu, Peng Yeen Chan, Jaime A. Bayan | 2007-02-27 |
| 6698088 | Universal clamping mechanism | Ah Lek Hu, Peng Yeen Chan, Jaime A. Bayan | 2004-03-02 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Santhiran Nadarajah +2 more | 2004-02-03 |
| 6467278 | Cooling for singulation of composite materials in molded semiconductor packages | Ah Lek Hu, Peng Yeen Chan | 2002-10-22 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Santhiran Nadarajah +2 more | 2002-09-17 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Santhiran Nadarajah +2 more | 2002-06-04 |