Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7181835 | Universal clamping mechanism | Ah Lek Hu, Sharon Mei Wan Ko, Jaime A. Bayan | 2007-02-27 |
| 6698088 | Universal clamping mechanism | Ah Lek Hu, Sharon Mei Wan Ko, Jaime A. Bayan | 2004-03-02 |
| 6467278 | Cooling for singulation of composite materials in molded semiconductor packages | Ah Lek Hu, Sharon Mei Wan Ko | 2002-10-22 |