Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465890 | Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages | Anindya Poddar | 2002-10-15 |
| 5789806 | Leadframe including bendable support arms for downsetting a die attach pad | Charlie Kho Chua, Peter Howard Spalding | 1998-08-04 |
| 5057907 | Method and structure for forming vertical semiconductor interconnection | Boon K. Ooi, Shiann-Ming Liou, Norman L. Gould | 1991-10-15 |