Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080565 | Chip packaging method and package structure | — | 2024-09-03 |
| 11610855 | Chip packaging method and package structure | — | 2023-03-21 |
| 11538695 | Packaging method, panel assembly, wafer package and chip package | — | 2022-12-27 |
| 11232957 | Chip packaging method and package structure | — | 2022-01-25 |
| 11233028 | Chip packaging method and chip structure | — | 2022-01-25 |
| 11114315 | Chip packaging method and package structure | — | 2021-09-07 |
| 11062917 | Packaging method, panel assembly, wafer package and chip package | — | 2021-07-13 |
| 10763133 | Semiconductor structure and semiconductor package device using the same | Kian-Hock Lim, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim | 2020-09-01 |
| 10109503 | Method of manufacturing semiconductor package device | Oviso Dominador Jr Fortaleza, Kian-Hock Lim, Shoa-Siong Raymond Lim | 2018-10-23 |
| 7692440 | Handler for semiconductor singulation and method therefor | Kok Yeow Lim, Fulin Liu | 2010-04-06 |
| 6550666 | Method for forming a flip chip on leadframe semiconductor package | Kim Hwee Tan | 2003-04-22 |