Shoa-Siong Raymond Lim has been granted 21 US patents while listed as an inventor at Advanpack Solutions Pte . The first was granted in 2014 and the most recent in September 2020. Shoa-Siong Raymond Lim ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Shoa-Siong Raymond Lim in Singapore, SG.
Patents per Year Patents granted per year, 2014 to 2020 Bar chart with a peak of 5 patents in 2017. peak 5 2014: 3 patents 2014 2015: 4 patents 2015 2016: 3 patents 2016 2017: 5 patents 2017 2018: 4 patents 2018 2019: 1 patents 2019 2020: 1 patents 2020 Issued Patents All Time
Showing 1–21 of 21 patents
Patent # Title Co-Inventors Date
10763133 Semiconductor structure and semiconductor package device using the same Jimmy Chew , Kian-Hock Lim , Oviso Dominador Jr Fortaleza 2020-09-01
10446457 Multi-layer substrate for semiconductor packaging Hwee-Seng Jimmy Chew 2019-10-15
10154588 Manufacturing method of semiconductor package Hwee-Seng Jimmy Chew 2018-12-11
10109503 Method of manufacturing semiconductor package device Jimmy Chew , Oviso Dominador Jr Fortaleza , Kian-Hock Lim 2018-10-23
10049950 Multi-layer substrate for semiconductor packaging Hwee-Seng Jimmy Chew 2018-08-14
9892916 Manufacturing method of package substrate and package manufacturing method of semiconductor device Hwee-Seng Jimmy Chew 2018-02-13
9847268 Semiconductor package and manufacturing method thereof Kian-Hock Lim 2017-12-19
9754899 Semiconductor structure and method of fabricating the same Hwee-Seng Jimmy Chew 2017-09-05
9723717 Substrate structure, semiconductor package device, and manufacturing method of semiconductor package Hwee-Seng Jimmy Chew 2017-08-01
9653323 Manufacturing method of substrate structure having embedded interconnection layers Hwee-Seng Jimmy Chew 2017-05-16
9583449 Semiconductor package Hwee-Seng Jimmy Chew , Kian-Hock Lim , Oviso Dominador Jr Fortaleza 2017-02-28
9379044 Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof Hwee-Seng Jimmy Chew 2016-06-28
9305868 Manufacturing method of forming an etch-back type semiconductor package with locking anchorages Hwee-Seng Jimmy Chew , Kian-Hock Lim 2016-04-05
9301391 Substrate structure, semiconductor package device, and manufacturing method of substrate structure Hwee-Seng Jimmy Chew 2016-03-29
9219027 Semiconductor device carrier and semiconductor package using the same Hwee-Seng Jimmy Chew , Kian-Hock Lim , Oviso Dominador Jr Fortaleza 2015-12-22
9136215 Manufacturing method for semiconductor package Klan Hock Lim 2015-09-15
9120169 Method for device packaging Hwee-Seng Jimmy Chew , Chee Kian Ong , Kian-Hock Lim , Amlan Sen 2015-09-01
9059050 Manufacturing methods of semiconductor substrate, package and device Kian-Hock Lim 2015-06-16
8917521 Etch-back type semiconductor package, substrate and manufacturing method thereof Hwee-Seng Jimmy Chew , Kian-Hock Lim 2014-12-23
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the same Hwee-Seng Jimmy Chew , Kian-Hock Lim , Oviso Dominador Jr Fortaleza 2014-04-29
8664750 Semiconductor substrate, package and device Kian-Hock Lim 2014-03-04