Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763133 | Semiconductor structure and semiconductor package device using the same | Jimmy Chew, Kian-Hock Lim, Oviso Dominador Jr Fortaleza | 2020-09-01 |
| 10446457 | Multi-layer substrate for semiconductor packaging | Hwee-Seng Jimmy Chew | 2019-10-15 |
| 10154588 | Manufacturing method of semiconductor package | Hwee-Seng Jimmy Chew | 2018-12-11 |
| 10109503 | Method of manufacturing semiconductor package device | Jimmy Chew, Oviso Dominador Jr Fortaleza, Kian-Hock Lim | 2018-10-23 |
| 10049950 | Multi-layer substrate for semiconductor packaging | Hwee-Seng Jimmy Chew | 2018-08-14 |
| 9892916 | Manufacturing method of package substrate and package manufacturing method of semiconductor device | Hwee-Seng Jimmy Chew | 2018-02-13 |
| 9847268 | Semiconductor package and manufacturing method thereof | Kian-Hock Lim | 2017-12-19 |
| 9754899 | Semiconductor structure and method of fabricating the same | Hwee-Seng Jimmy Chew | 2017-09-05 |
| 9723717 | Substrate structure, semiconductor package device, and manufacturing method of semiconductor package | Hwee-Seng Jimmy Chew | 2017-08-01 |
| 9653323 | Manufacturing method of substrate structure having embedded interconnection layers | Hwee-Seng Jimmy Chew | 2017-05-16 |
| 9583449 | Semiconductor package | Hwee-Seng Jimmy Chew, Kian-Hock Lim, Oviso Dominador Jr Fortaleza | 2017-02-28 |
| 9379044 | Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof | Hwee-Seng Jimmy Chew | 2016-06-28 |
| 9305868 | Manufacturing method of forming an etch-back type semiconductor package with locking anchorages | Hwee-Seng Jimmy Chew, Kian-Hock Lim | 2016-04-05 |
| 9301391 | Substrate structure, semiconductor package device, and manufacturing method of substrate structure | Hwee-Seng Jimmy Chew | 2016-03-29 |
| 9219027 | Semiconductor device carrier and semiconductor package using the same | Hwee-Seng Jimmy Chew, Kian-Hock Lim, Oviso Dominador Jr Fortaleza | 2015-12-22 |
| 9136215 | Manufacturing method for semiconductor package | Klan Hock Lim | 2015-09-15 |
| 9120169 | Method for device packaging | Hwee-Seng Jimmy Chew, Chee Kian Ong, Kian-Hock Lim, Amlan Sen | 2015-09-01 |
| 9059050 | Manufacturing methods of semiconductor substrate, package and device | Kian-Hock Lim | 2015-06-16 |
| 8917521 | Etch-back type semiconductor package, substrate and manufacturing method thereof | Hwee-Seng Jimmy Chew, Kian-Hock Lim | 2014-12-23 |
| 8709874 | Manufacturing method for semiconductor device carrier and semiconductor package using the same | Hwee-Seng Jimmy Chew, Kian-Hock Lim, Oviso Dominador Jr Fortaleza | 2014-04-29 |
| 8664750 | Semiconductor substrate, package and device | Kian-Hock Lim | 2014-03-04 |