Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12270119 | Plating apparatus and operation method thereof | Navaneetha Kumaran Baheerathan | 2025-04-08 |
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Hwee-Seng Jimmy Chew, Li Jiang Huang, Siew Wen Lee, Qing Guan, Wai Hoe Lee +1 more | 2024-12-31 |
| 11990445 | Apparatus and method for semiconductor device bonding | — | 2024-05-21 |
| 11817326 | Precision reconstruction for panel-level packaging | Chian Soon Chua, Qing Guan, Wai Hoe Lee | 2023-11-14 |
| 11810797 | Wetting processing apparatus and operation method thereof | Navaneetha Kumaran Baheerathan | 2023-11-07 |
| 11552043 | Post bond inspection of devices for panel packaging | Chian Soon Chua, Wai Hoe Lee, Qing Guan | 2023-01-10 |
| 11518070 | Compression molding machine and method of compression molding | — | 2022-12-06 |
| 11456259 | Panel level packaging for devices | — | 2022-09-27 |
| 11261535 | Plating apparatus and operation method thereof | Navaneetha Kumaran Baheerathan | 2022-03-01 |
| 11107716 | Automation line for processing a molded panel | — | 2021-08-31 |
| 9120169 | Method for device packaging | Hwee-Seng Jimmy Chew, Chee Kian Ong, Kian-Hock Lim, Shoa-Siong Raymond Lim | 2015-09-01 |
| 9082775 | System for encapsulation of semiconductor dies | Chin Guan Khaw | 2015-07-14 |