Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Hwee-Seng Jimmy Chew, Amlan Sen, Li Jiang Huang, Siew Wen Lee, Qing Guan +1 more | 2024-12-31 |
| 11817326 | Precision reconstruction for panel-level packaging | Amlan Sen, Chian Soon Chua, Qing Guan | 2023-11-14 |
| 11552043 | Post bond inspection of devices for panel packaging | Amlan Sen, Chian Soon Chua, Qing Guan | 2023-01-10 |