Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Amlan Sen, Li Jiang Huang, Siew Wen Lee, Qing Guan, Wai Hoe Lee +1 more | 2024-12-31 |
| 11990353 | Semiconductor device with buffer layer | Senthil Kumar MUNIRATHINAM | 2024-05-21 |
| 11990431 | Semiconductor structures with via openings and methods of making the same | — | 2024-05-21 |
| 11881415 | Method of packaging chip and chip package structure | — | 2024-01-23 |
| 11049734 | Method of packaging chip and chip package structure | — | 2021-06-29 |
| 10615056 | Method of packaging chip and chip package structure | — | 2020-04-07 |
| 10446457 | Multi-layer substrate for semiconductor packaging | Shoa-Siong Raymond Lim | 2019-10-15 |
| 10431477 | Method of packaging chip and chip package structure | — | 2019-10-01 |
| 10154588 | Manufacturing method of semiconductor package | Shoa-Siong Raymond Lim | 2018-12-11 |
| 10049950 | Multi-layer substrate for semiconductor packaging | Shoa-Siong Raymond Lim | 2018-08-14 |
| 9892916 | Manufacturing method of package substrate and package manufacturing method of semiconductor device | Shoa-Siong Raymond Lim | 2018-02-13 |
| 9754899 | Semiconductor structure and method of fabricating the same | Shoa-Siong Raymond Lim | 2017-09-05 |
| 9723717 | Substrate structure, semiconductor package device, and manufacturing method of semiconductor package | Shoa-Siong Raymond Lim | 2017-08-01 |
| 9653323 | Manufacturing method of substrate structure having embedded interconnection layers | Shoa-Siong Raymond Lim | 2017-05-16 |
| 9583449 | Semiconductor package | Kian-Hock Lim, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim | 2017-02-28 |
| 9396982 | Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof | Chee Kian Ong, Bin Chichik Abd. Razak | 2016-07-19 |
| 9379044 | Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof | Shoa-Siong Raymond Lim | 2016-06-28 |
| 9362206 | Chip and manufacturing method thereof | Chee Kian Ong | 2016-06-07 |
| 9305868 | Manufacturing method of forming an etch-back type semiconductor package with locking anchorages | Shoa-Siong Raymond Lim, Kian-Hock Lim | 2016-04-05 |
| 9301391 | Substrate structure, semiconductor package device, and manufacturing method of substrate structure | Shoa-Siong Raymond Lim | 2016-03-29 |
| 9287157 | Semiconductor element for package miniaturization | Chee Kian Ong, Bin Chichik Abd. Razak | 2016-03-15 |
| 9219027 | Semiconductor device carrier and semiconductor package using the same | Kian-Hock Lim, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim | 2015-12-22 |
| 9120169 | Method for device packaging | Chee Kian Ong, Kian-Hock Lim, Amlan Sen, Shoa-Siong Raymond Lim | 2015-09-01 |
| 8917521 | Etch-back type semiconductor package, substrate and manufacturing method thereof | Shoa-Siong Raymond Lim, Kian-Hock Lim | 2014-12-23 |
| 8846519 | Interconnections for fine pitch semiconductor devices and manufacturing method thereof | Chee Kian Ong | 2014-09-30 |