Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2024-11-19 |
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2022-01-18 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |
| 7294827 | Electronic module with light-blocking features | Binghua Pan, Jeffrey H. Burns, John R. Troxell | 2007-11-13 |