Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Bartholomew Liao | 2024-11-19 |
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Bartholomew Liao | 2022-01-18 |
| 10916482 | Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure | Yung Kuan Hsiao | 2021-02-09 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Bartholomew Liao | 2017-04-18 |
| 8524577 | Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure | Yung Kuan Hsiao | 2013-09-03 |
| 8513098 | Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure | Yung Kuan Hsiao | 2013-08-20 |