Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2024-11-19 |
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2022-01-18 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin | 2019-03-26 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Jun Mo Koo, Pandi C. Marimuthu, Yaojian Lin | 2017-01-31 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-01-19 |