Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2017-08-01 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-03-15 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +2 more | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, JaeHak Yee, YoungChul Kim, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2016-01-19 |