Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua | 2024-11-19 |
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua | 2022-01-18 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua | 2017-04-18 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Zigmund Ramirez Camacho, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao | 2016-05-03 |
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Zigmund Ramirez Camacho | 2015-12-01 |