JunMo Koo — 6 Patents at Stats Chippac

JunMo Koo has been granted 6 US patents while listed as an inventor at Stats Chippac. The first was granted in 2013 and the most recent in August 2025. JunMo Koo ranks #779,687 of 4,157,543 US inventors in our database (top 18.8%). Patent records list JunMo Koo in Hwaseong-si, KR.

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Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date
12388046	Semiconductor package	Hongwon KIM, Yeonjoo Kim, Yunhee Kim, Jongkook Kim, Doohwan Lee +1 more	2025-08-12
9865554	Integrated circuit packaging system with under bump metallization and method of manufacture thereof	Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho	2018-01-09
9257411	Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation	Reza A. Pagaila, Yaojian Lin	2016-02-09
9202793	Integrated circuit packaging system with under bump metallization and method of manufacture thereof	Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, Bartholomew Liao, Zigmund Ramirez Camacho	2015-12-01
9059157	Integrated circuit packaging system with substrate and method of manufacture thereof	Yaojian Lin, Il Kwon Shim, Jose Alvin Caparas	2015-06-16
8399306	Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof	Pandi C. Marimuthu, Jae Hun Ku, Jose Alvin Caparas, Shariff Dzafir	2013-03-19

JunMo Koo — 6 Patents

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