Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388046 | Semiconductor package | Hongwon KIM, Yeonjoo Kim, Yunhee Kim, Jongkook Kim, Doohwan Lee +1 more | 2025-08-12 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |
| 9257411 | Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation | Reza A. Pagaila, Yaojian Lin | 2016-02-09 |
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, Bartholomew Liao, Zigmund Ramirez Camacho | 2015-12-01 |
| 9059157 | Integrated circuit packaging system with substrate and method of manufacture thereof | Yaojian Lin, Il Kwon Shim, Jose Alvin Caparas | 2015-06-16 |
| 8399306 | Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof | Pandi C. Marimuthu, Jae Hun Ku, Jose Alvin Caparas, Shariff Dzafir | 2013-03-19 |