Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399306 | Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof | JunMo Koo, Pandi C. Marimuthu, Jae Hun Ku, Jose Alvin Caparas | 2013-03-19 |