Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837336 | Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief | Won Kyoung Choi, Chang Bum Yong | 2017-12-05 |
| 9601462 | Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer | Won Kyoung Choi, Chang Beom Yong | 2017-03-21 |
| 9362210 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2016-06-07 |
| 9224647 | Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer | Jun Mo Koo, Pandi C. Marimuthu, Seung Wook Yoon | 2015-12-29 |
| 9054083 | Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2015-06-09 |
| 8809191 | Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer | Won Kyoung Choi, Chang Bum Yong | 2014-08-19 |
| 8742591 | Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief | Won Kyoung Choi, Chang Bum Yong | 2014-06-03 |
| 8659162 | Semiconductor device having an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2014-02-25 |
| 8410585 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2013-04-02 |
| 8399306 | Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof | JunMo Koo, Pandi C. Marimuthu, Jose Alvin Caparas, Shariff Dzafir | 2013-03-19 |
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2011-11-29 |
| 8035204 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jose Alvin Caparas | 2011-10-11 |
| 7700404 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jose Alvin Caparas | 2010-04-20 |
| 7564122 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2009-07-21 |
| 7413933 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jeffrey D. Punzalan, Byung Joon Han | 2008-08-19 |
| 7339258 | Dual row leadframe and fabrication method | Jeffrey D. Punzalan, Jose Alvin Caparas | 2008-03-04 |
| 7217599 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jeffrey D. Punzalan, Byung Joon Han | 2007-05-15 |
| 7129569 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jose Alvin Caparas | 2006-10-31 |
| 7060536 | Dual row leadframe and fabrication method | Jeffrey D. Punzalan, Jose Alvin Caparas | 2006-06-13 |
| 7057280 | Leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2006-06-06 |
| 7042068 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2006-05-09 |
| 6953988 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hak Yee | 2005-10-11 |
| 6858919 | Semiconductor package | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hak Yee | 2005-02-22 |
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2004-11-30 |
| 6759737 | Semiconductor package including stacked chips with aligned input/output pads | Seong Min Seo, Young Suk Chung, Jong Sik Paek, Jae Hak Yee | 2004-07-06 |