Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362210 | Leadframe and semiconductor package made using the leadframe | Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2016-06-07 |
| 8536688 | Integrated circuit leadframe and fabrication method therefor | Pandi C. Marimuthu | 2013-09-17 |
| 8410585 | Leadframe and semiconductor package made using the leadframe | Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2013-04-02 |
| 7960816 | Semiconductor package with passive device integration | Seng Guan Chow, Il Kwon Shim, Ming Ying | 2011-06-14 |
| 7833840 | Integrated circuit package system with down-set die pad and method of manufacture thereof | OhSug Kim | 2010-11-16 |
| 7205651 | Thermally enhanced stacked die package and fabrication method | Byung Tai Do | 2007-04-17 |
| 7135760 | Moisture resistant integrated circuit leadframe package | Byung Joon Han | 2006-11-14 |
| 7091596 | Semiconductor packages and leadframe assemblies | Byung Joon Han | 2006-08-15 |
| 7064420 | Integrated circuit leadframe with ground plane | Byung Joon Han, Zheng Zheng | 2006-06-20 |
| 7042068 | Leadframe and semiconductor package made using the leadframe | Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang, Young Nam Choi +1 more | 2006-05-09 |
| 7005325 | Semiconductor package with passive device integration | Seng Guan Chow, Il Kwon Shim, Ming Ying | 2006-02-28 |
| 6858470 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof | Byung Joon Han | 2005-02-22 |
| 5505486 | Air bag mounting device | — | 1996-04-09 |
| 5457750 | Method and device for reducing noises generated at an indoor unit of a separate type room air conditioner package | — | 1995-10-10 |