Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12124103 | Liquid lens | Raymond Miller Karam, Daniel Ohen Ricketts | 2024-10-22 |
| 11992894 | Method of separating a liquid lens from an array of liquid lenses | Hasan Fiaz, Jann Paul Kaminski, Raymond Miller Karam, Brian Nilsen, Marie B. O'Regan +3 more | 2024-05-28 |
| 11852560 | Devices with liquid lenses and test methods and assemblies for testing devices with liquid lenses | Petr Gorelchenko, Raymond Miller Karam, Jonathan David Pesansky, Michael David Shorkey | 2023-12-26 |
| 11799970 | Technologies for cloud-hybrid remote browser isolation | Suriya Kandaswamy, Roshan Padaki, Karthick Jeyapal, Philippe Noël, Owen M. Niles | 2023-10-24 |
| 11346984 | Liquid lenses | Raymond Miller Karam | 2022-05-31 |
| 10357201 | Appendage mountable electronic devices conformable to surfaces | John A. Rogers, Andrew P. Bonifas, Nanshu Lu | 2019-07-23 |
| 10052066 | Appendage mountable electronic devices conformable to surfaces | John A. Rogers, Andrew P. Bonifas, Nanshu Lu | 2018-08-21 |
| 9554484 | Appendage mountable electronic devices conformable to surfaces | John A. Rogers, Andrew P. Bonifas, Nanshu Lu | 2017-01-24 |
| 9481915 | Method of screening drugs that promote LOXL1 expression | Xiaoqing Liu, Lihua Jian | 2016-11-01 |
| 9321995 | Stem cell culture medium and its applications as well as a stem cell culture method | Xiaoqing Liu, Guangfeng Chen, Longpo Zheng | 2016-04-26 |
| 8587098 | Integrated circuit protruding pad package system and method for manufacturing thereof | Seng Guan Chow, Il Kwon Shim, Roger Emigh | 2013-11-19 |
| 8180427 | Apparatus and method for non-invasively sensing pulse rate and blood flow anomalies | Chee Teck Phua, See Hoon Kam, Boon Chong Gooi | 2012-05-15 |
| 8102040 | Integrated circuit package system with die and package combination | Seng Guan Chow, Il Kwon Shim | 2012-01-24 |
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, II Kwon Shim, Lip Seng Tan | 2011-07-26 |
| 7968377 | Integrated circuit protruding pad package system | Seng Guan Chow, Il Kwon Shim, Roger Emigh | 2011-06-28 |
| 7960816 | Semiconductor package with passive device integration | Seng Guan Chow, Il Kwon Shim, Byung Hoon Ahn | 2011-06-14 |
| 7598599 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Il Kwon Shim, Lip Seng Tan | 2009-10-06 |
| 7598606 | Integrated circuit package system with die and package combination | Seng Guan Chow, Il Kwon Shim | 2009-10-06 |
| 7388280 | Package stacking lead frame system | Il Kwon Shim, Seng Guan Chow | 2008-06-17 |
| 7064430 | Stacked die packaging and fabrication method | Seng Guan Chow, Il Kwon Shim, Roger Emigh | 2006-06-20 |
| 7005325 | Semiconductor package with passive device integration | Seng Guan Chow, Il Kwon Shim, Byung Hoon Ahn | 2006-02-28 |