Ming Ying — 22 Patents at Stats Chippac

Ming Ying has been granted 22 US patents while listed as an inventor at Stats Chippac. The first was granted in 2006 and the most recent in November 2025. Ming Ying ranks #189,202 of 4,157,543 US inventors in our database (top 4.6%). Patent records list Ming Ying in Shanghai, IL, CN.

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12466766	Laser bonding of glass to thin metal foil	Jason Roy Grenier, Sasha Marjanovic, Bertrand Paris, Jonathan David Pesansky, Kristopher Allen Wieland	2025-11-11
12124103	Liquid lens	Raymond Miller Karam, Daniel Ohen Ricketts	2024-10-22	$15,278,000
11992894	Method of separating a liquid lens from an array of liquid lenses	Hasan Fiaz, Jann Paul Kaminski, Raymond Miller Karam, Brian Nilsen, Marie B. O'Regan +3 more	2024-05-28	$14,223,000
11852560	Devices with liquid lenses and test methods and assemblies for testing devices with liquid lenses	Petr Gorelchenko, Raymond Miller Karam, Jonathan David Pesansky, Michael David Shorkey	2023-12-26	$10,595,000
11799970	Technologies for cloud-hybrid remote browser isolation	Suriya Kandaswamy, Roshan Padaki, Karthick Jeyapal, Philippe Noël, Owen M. Niles	2023-10-24
11346984	Liquid lenses	Raymond Miller Karam	2022-05-31	$21,548,000
10357201	Appendage mountable electronic devices conformable to surfaces	John A. Rogers, Andrew P. Bonifas, Nanshu Lu	2019-07-23
10052066	Appendage mountable electronic devices conformable to surfaces	John A. Rogers, Andrew P. Bonifas, Nanshu Lu	2018-08-21
9554484	Appendage mountable electronic devices conformable to surfaces	John A. Rogers, Andrew P. Bonifas, Nanshu Lu	2017-01-24
9481915	Method of screening drugs that promote LOXL1 expression	Xiaoqing Liu, Lihua Jian	2016-11-01
9321995	Stem cell culture medium and its applications as well as a stem cell culture method	Xiaoqing Liu, Guangfeng Chen, Longpo Zheng	2016-04-26
8587098	Integrated circuit protruding pad package system and method for manufacturing thereof	Seng Guan Chow, Il Kwon Shim, Roger Emigh	2013-11-19
8180427	Apparatus and method for non-invasively sensing pulse rate and blood flow anomalies	Chee Teck Phua, See Hoon Kam, Boon Chong Gooi	2012-05-15
8102040	Integrated circuit package system with die and package combination	Seng Guan Chow, Il Kwon Shim	2012-01-24
7986032	Semiconductor package system with substrate having different bondable heights at lead finger tips	Seng Guan Chow, II Kwon Shim, Lip Seng Tan	2011-07-26
7968377	Integrated circuit protruding pad package system	Seng Guan Chow, Il Kwon Shim, Roger Emigh	2011-06-28
7960816	Semiconductor package with passive device integration	Seng Guan Chow, Il Kwon Shim, Byung Hoon Ahn	2011-06-14
7598606	Integrated circuit package system with die and package combination	Seng Guan Chow, Il Kwon Shim	2009-10-06
7598599	Semiconductor package system with substrate having different bondable heights at lead finger tips	Seng Guan Chow, Il Kwon Shim, Lip Seng Tan	2009-10-06
7388280	Package stacking lead frame system	Il Kwon Shim, Seng Guan Chow	2008-06-17
7064430	Stacked die packaging and fabrication method	Seng Guan Chow, Il Kwon Shim, Roger Emigh	2006-06-20	$1,478,000
7005325	Semiconductor package with passive device integration	Seng Guan Chow, Il Kwon Shim, Byung Hoon Ahn	2006-02-28	$1,531,000

Ming Ying — 22 Patents

Issued Patents All Time

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