Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, II Kwon Shim | 2011-07-26 |
| 7598599 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, Il Kwon Shim | 2009-10-06 |