Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8617924 | Stacked integrated circuit package-in-package system and method of manufacture thereof | Jong-Woo Ha, Jong Wook Ju | 2013-12-31 |
| 8089166 | Integrated circuit package with top pad | — | 2012-01-03 |
| 7968371 | Semiconductor package system with cavity substrate | DeaWhan Kim, Sangjo Kim | 2011-06-28 |
| 7833840 | Integrated circuit package system with down-set die pad and method of manufacture thereof | Byung Hoon Ahn | 2010-11-16 |
| 7635913 | Stacked integrated circuit package-in-package system | Jong-Woo Ha, Jong Wook Ju | 2009-12-22 |