JJ

Jong Wook Ju

SC Stats Chippac: 15 patents #58 of 425Top 15%
CH Chippac: 3 patents #14 of 42Top 35%
Overall (All Time): #257,240 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8956914 Integrated circuit package system with overhang die Ja Eun Yun 2015-02-17
8659175 Integrated circuit package system with offset stack Taeg Ki Lim, Hyun Joung Kim 2014-02-25
8632112 Workpiece displacement system Hyunjoo KIM, Hunki LEE, Changyong Lee, Sang Ho Lee 2014-01-21
8623704 Adhesive/spacer island structure for multiple die package Sang Ho Lee, Hyeog Chan Kwon 2014-01-07
8617924 Stacked integrated circuit package-in-package system and method of manufacture thereof OhSug Kim, Jong-Woo Ha 2013-12-31
8569882 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof WonJun Ko, Sungmin Song, JaEun Yun, Hye Ran Lee 2013-10-29
8552551 Adhesive/spacer island structure for stacking over wire bonded die Sang Ho Lee, Hyeog Chan Kwon, Marcos Karnezos 2013-10-08
8415204 Integrated circuit packaging system with heat spreader and method of manufacture thereof JaEun Yun, WonJun Ko, Hye Ran Lee 2013-04-09
8217501 Integrated circuit package system including honeycomb molding Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim 2012-07-10
8143102 Integrated circuit package system including die having relieved active region Byung Tai Do, Sang Ho Lee 2012-03-27
8067275 Integrated circuit package system with package integration WonJun Ko, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun 2011-11-29
8067831 Integrated circuit package system with planar interconnects Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim 2011-11-29
7772683 Stacked integrated circuit package-in-package system Ki Youn Jang, Jong-Woo Ha 2010-08-10
7763961 Hybrid stacking package system Seung Wook Park 2010-07-27
7737539 Integrated circuit package system including honeycomb molding Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim 2010-06-15
7635913 Stacked integrated circuit package-in-package system OhSug Kim, Jong-Woo Ha 2009-12-22
7443037 Stacked integrated circuit package system with connection protection Hyun Joung Kim, Taeg Ki Lim 2008-10-28
7306971 Semiconductor chip packaging method with individually placed film adhesive pieces Jin-Wook Jeong, In Sang Yoon, Hee Bong Lee, Hyun Joon Oh, Hyeog Chan Kwon +1 more 2007-12-11