Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8956914 | Integrated circuit package system with overhang die | Ja Eun Yun | 2015-02-17 |
| 8659175 | Integrated circuit package system with offset stack | Taeg Ki Lim, Hyun Joung Kim | 2014-02-25 |
| 8632112 | Workpiece displacement system | Hyunjoo KIM, Hunki LEE, Changyong Lee, Sang Ho Lee | 2014-01-21 |
| 8623704 | Adhesive/spacer island structure for multiple die package | Sang Ho Lee, Hyeog Chan Kwon | 2014-01-07 |
| 8617924 | Stacked integrated circuit package-in-package system and method of manufacture thereof | OhSug Kim, Jong-Woo Ha | 2013-12-31 |
| 8569882 | Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof | WonJun Ko, Sungmin Song, JaEun Yun, Hye Ran Lee | 2013-10-29 |
| 8552551 | Adhesive/spacer island structure for stacking over wire bonded die | Sang Ho Lee, Hyeog Chan Kwon, Marcos Karnezos | 2013-10-08 |
| 8415204 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | JaEun Yun, WonJun Ko, Hye Ran Lee | 2013-04-09 |
| 8217501 | Integrated circuit package system including honeycomb molding | Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim | 2012-07-10 |
| 8143102 | Integrated circuit package system including die having relieved active region | Byung Tai Do, Sang Ho Lee | 2012-03-27 |
| 8067275 | Integrated circuit package system with package integration | WonJun Ko, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun | 2011-11-29 |
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim | 2011-11-29 |
| 7772683 | Stacked integrated circuit package-in-package system | Ki Youn Jang, Jong-Woo Ha | 2010-08-10 |
| 7763961 | Hybrid stacking package system | Seung Wook Park | 2010-07-27 |
| 7737539 | Integrated circuit package system including honeycomb molding | Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim | 2010-06-15 |
| 7635913 | Stacked integrated circuit package-in-package system | OhSug Kim, Jong-Woo Ha | 2009-12-22 |
| 7443037 | Stacked integrated circuit package system with connection protection | Hyun Joung Kim, Taeg Ki Lim | 2008-10-28 |
| 7306971 | Semiconductor chip packaging method with individually placed film adhesive pieces | Jin-Wook Jeong, In Sang Yoon, Hee Bong Lee, Hyun Joon Oh, Hyeog Chan Kwon +1 more | 2007-12-11 |