Jong Wook Ju — 18 Patents at Stats Chippac

Jong Wook Ju has been granted 18 US patents while listed as an inventor at Stats Chippac. The first was granted in 2007 and the most recent in February 2015. Jong Wook Ju ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Jong Wook Ju in Gyeongsan-si, KR.

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #	Title	Co-Inventors	Date
8956914	Integrated circuit package system with overhang die	Ja Eun Yun	2015-02-17
8659175	Integrated circuit package system with offset stack	Taeg Ki Lim, Hyun Joung Kim	2014-02-25
8632112	Workpiece displacement system	Hyunjoo KIM, Hunki LEE, Changyong Lee, Sang Ho Lee	2014-01-21
8623704	Adhesive/spacer island structure for multiple die package	Sang Ho Lee, Hyeog Chan Kwon	2014-01-07
8617924	Stacked integrated circuit package-in-package system and method of manufacture thereof	OhSug Kim, Jong-Woo Ha	2013-12-31
8569882	Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof	WonJun Ko, Sungmin Song, JaEun Yun, Hye Ran Lee	2013-10-29
8552551	Adhesive/spacer island structure for stacking over wire bonded die	Sang Ho Lee, Hyeog Chan Kwon, Marcos Karnezos	2013-10-08
8415204	Integrated circuit packaging system with heat spreader and method of manufacture thereof	JaEun Yun, WonJun Ko, Hye Ran Lee	2013-04-09
8217501	Integrated circuit package system including honeycomb molding	Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim	2012-07-10
8143102	Integrated circuit package system including die having relieved active region	Byung Tai Do, Sang Ho Lee	2012-03-27
8067275	Integrated circuit package system with package integration	WonJun Ko, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun	2011-11-29
8067831	Integrated circuit package system with planar interconnects	Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim	2011-11-29
7772683	Stacked integrated circuit package-in-package system	Ki Youn Jang, Jong-Woo Ha	2010-08-10
7763961	Hybrid stacking package system	Seung Wook Park	2010-07-27
7737539	Integrated circuit package system including honeycomb molding	Hyeog Chan Kwon, Hyun Joung Kim, Jae-Chang Kim, Taeg Ki Lim	2010-06-15
7635913	Stacked integrated circuit package-in-package system	OhSug Kim, Jong-Woo Ha	2009-12-22
7443037	Stacked integrated circuit package system with connection protection	Hyun Joung Kim, Taeg Ki Lim	2008-10-28
7306971	Semiconductor chip packaging method with individually placed film adhesive pieces	Jin-Wook Jeong, In Sang Yoon, Hee Bong Lee, Hyun Joon Oh, Hyeog Chan Kwon +1 more	2007-12-11

Jong Wook Ju — 18 Patents

Issued Patents All Time

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