Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48641 | Mobile communication terminal having radiant-heat sheet | Kyung-Ha Koo, Kun-Tak Kim, Ki Cheol BAE, Hyun-Deok Seo, Hyun-Tae Jang +1 more | 2021-07-13 |
| 10842057 | Shield can assembly and electronic device including the same | Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An | 2020-11-17 |
| 10698461 | Electronic device and heat control method based on temperature of battery in electronic device | Kyung-Ha Koo, Kun-Tak Kim, Hyun-Tae Jang, Chi Hwan Jeong, Chi-Hyun Cho | 2020-06-30 |
| 10470345 | Electronic device including shield structure | Jae-Heung Ye, Jung-Je Bang, Jeong-Ung Kim | 2019-11-05 |
| 10340737 | Electronic device and method for controlling fan of electronic device | Ku-Chul Jung, Kyung-Ha Koo, Chul-Woo Park, Yong-Sang Yun, Chi-Hyun Cho | 2019-07-02 |
| 10197457 | Heating control method and electronic device thereof | Min Su Kim, Kun-Tak Kim, Chi-Hyun Cho | 2019-02-05 |
| 10064318 | Shield can assembly and electronic device including the same | Jeong-Ung Kim, Jung-Je Bang, Sang-Hyun An | 2018-08-28 |
| 9582051 | Mobile communication terminal having radiant-heat sheet | Kyung-Ha Koo, Kun-Tak Kim, Ki Cheol BAE, Hyun-Deok Seo, Hyun-Tae Jang +1 more | 2017-02-28 |
| 9202715 | Integrated circuit packaging system with connection structure and method of manufacture thereof | YoungChul Kim, KyungHoon Lee, Seong Won Park, Jaehyun Lee, DeokKyung Yang +2 more | 2015-12-01 |
| 9129826 | Epoxy bump for overhang die | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim | 2015-09-08 |
| 8772916 | Integrated circuit package system employing mold flash prevention technology | Sungmin Song, JoHyun Bae | 2014-07-08 |
| 8703541 | Electronic system with expansion feature | Haengcheol Choi, TaeWoo Kang, Il Kwon Shim | 2014-04-22 |
| 8524538 | Integrated circuit packaging system with film assistance mold and method of manufacture thereof | Jaehyun Lee, DokOk Yu | 2013-09-03 |
| 8519517 | Semiconductor system with fine pitch lead fingers and method of manufacturing thereof | Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2013-08-27 |
| 8513057 | Integrated circuit packaging system with routable underlayer and method of manufacture thereof | Oh Han Kim, DaeSik Choi, DongSoo Moon | 2013-08-20 |
| 8471394 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2013-06-25 |
| 8368200 | Shielded stacked integrated circuit packaging system and method of manufacture thereof | Youngmin Kim, Hyung Jun Jeon | 2013-02-05 |
| 8304900 | Integrated circuit packaging system with stacked lead and method of manufacture thereof | Youngjoon KIM, JoHyun Bae | 2012-11-06 |
| 8256660 | Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof | Hun Teak Lee, Jong Kook Kim, ChulSik Kim | 2012-09-04 |
| 8252615 | Integrated circuit package system employing mold flash prevention technology | Sungmin Song, JoHyun Bae | 2012-08-28 |
| 8178392 | Electronic system with expansion feature | Haengcheol Choi, TaeWoo Kang, Il Kwon Shim | 2012-05-15 |
| 8129263 | Wire bond interconnection and method of manufacture thereof | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Rajendra D. Pendse | 2012-03-06 |
| 8110908 | Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof | Youngjoon KIM | 2012-02-07 |
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2011-10-11 |
| 8018040 | Shielded stacked integrated circuit packaging system and method of manufacture thereof | Youngmin Kim, Hyung Jun Jeon | 2011-09-13 |