Issued Patents All Time
Showing 25 most recent of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432635 | Electronic device for WLAN communication with plurality of external devices and operation method thereof | Buseop JUNG, Hyejung BANG, Sunkee LEE, Junsu CHOI | 2025-09-30 |
| 12381945 | Method for managing persistent group information of electronic device | Buseop JUNG, Beomjip KIM, Hakkwan Kim, Hyejung BANG, Dooho LEE +3 more | 2025-08-05 |
| 12100663 | Semiconductor device and method of integrating RF antenna interposer with semiconductor package | Youngcheol Kim, Haengcheol Choi | 2024-09-24 |
| 11765245 | Electronic device and method for performing service discovery in electronic device | Buseop JUNG, Hyejung BANG | 2023-09-19 |
| 11735530 | Semiconductor device and method of integrating RF antenna interposer with semiconductor package | Youngcheol Kim, Haengcheol Choi | 2023-08-22 |
| 11503451 | Device and method for transmitting signals in plurality of frequency bands | Buseop JUNG, Bumjib Kim, Hyejung BANG, Soonho LEE, Dooho LEE +2 more | 2022-11-15 |
| 11297666 | Electronic device and method for forming Wi-Fi direct group thereof | Hyejung BANG, Bumjib Kim, Hyunah Oh, Dongjea Jung, Buseop JUNG +3 more | 2022-04-05 |
| 11284248 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2022-03-22 |
| 10903183 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | HeeJo Chi, HanGil Shin | 2021-01-26 |
| 10674555 | Electronic device and method for forming Wi-Fi direct group thereof | Hyejung BANG, Bumjib Kim, Hyunah Oh, Dongjea Jung, Buseop JUNG +3 more | 2020-06-02 |
| 10573600 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | HeeJo Chi, Junwoo Myung | 2020-02-25 |
| 10548178 | Method and device for establishing communication connection | Bu-Seop JUNG, Soonho LEE | 2020-01-28 |
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, HanGil Shin | 2019-12-17 |
| 10397773 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2019-08-27 |
| 9966335 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | HeeJo Chi, HanGil Shin | 2018-05-08 |
| 9894516 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2018-02-13 |
| 9842808 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | HanGil Shin, HeeJo Chi | 2017-12-12 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, HanGil Shin, Kyung-Moon Kim | 2017-08-29 |
| 9735113 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | HeeJo Chi, Junwoo Myung | 2017-08-15 |
| 9730256 | Method and apparatus for discovering device in wireless communication network | Changsoon Kim, Byunghoon Seo, Jongmu Choi, Hakkwan Kim, Chanki Cho | 2017-08-08 |
| 9691707 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, HanGil Shin | 2017-06-27 |
| 9578494 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2017-02-21 |
| 9558965 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, HanGil Shin | 2017-01-31 |
| 9508635 | Methods of forming conductive jumper traces | HanGil Shin, HeeJo Chi | 2016-11-29 |
| 9496152 | Carrier system with multi-tier conductive posts and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2016-11-15 |