Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397050 | Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant | HanGil Shin, HeeJo Chi | 2016-07-19 |
| 9362161 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, HanGil Shin | 2016-06-07 |
| 9355939 | Integrated circuit package stacking system with shielding and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2016-05-31 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HeeJo Chi, HanGil Shin, Kyung-Moon Kim | 2016-03-29 |
| 9269691 | Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer | HeeJo Chi, HanGil Shin | 2016-02-23 |
| 9269595 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, HanGil Shin | 2016-02-23 |
| 9263332 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | HeeJo Chi, HanGil Shin | 2016-02-16 |
| 9064859 | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe | HeeJo Chi, HanGil Shin | 2015-06-23 |
| 9055391 | Method and apparatus for discovering device in wireless communication network | Changsoon Kim, Byunghoon Seo, Jongmu Choi, Hakkwan Kim, Chanki Cho | 2015-06-09 |
| 9054098 | Integrated circuit packaging system with redistribution layer and method of manufacture thereof | HeeJo Chi, ChanHoon Ko | 2015-06-09 |
| 9048306 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | HeeJo Chi, HanGil Shin | 2015-06-02 |
| 8932907 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | HeeJo Chi, HanGil Shin | 2015-01-13 |
| 8901755 | Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die | HeeJo Chi, HanGil Shin | 2014-12-02 |
| 8749040 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2014-06-10 |
| 8716065 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2014-05-06 |
| 8624370 | Integrated circuit packaging system with an interposer and method of manufacture thereof | HeeJo Chi, Taewoo Lee | 2014-01-07 |
| 8587129 | Integrated circuit packaging system with through silicon via base and method of manufacture thereof | HeeJo Chi, YeongIm Park | 2013-11-19 |
| 8564125 | Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-10-22 |
| 8541872 | Integrated circuit package system with package stacking and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-09-24 |
| 8492888 | Integrated circuit packaging system with stiffener and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-07-23 |
| 8476111 | Integrated circuit packaging system with intra substrate die and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-07-02 |
| 8471394 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Ki Youn Jang, HeeJo Chi | 2013-06-25 |
| 8455300 | Integrated circuit package system with embedded die superstructure and method of manufacture thereof | HeeJo Chi, ChanHoon Ko | 2013-06-04 |
| 8421203 | Integrated circuit packaging system with foldable substrate and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-04-16 |
| 8390108 | Integrated circuit packaging system with stacking interconnect and method of manufacture thereof | HeeJo Chi, HanGil Shin, Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2013-03-05 |