Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8389329 | Integrated circuit packaging system with package stacking and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-03-05 |
| 8384227 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | HeeJo Chi, HanGil Shin | 2013-02-26 |
| 8349658 | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe | HeeJo Chi, HanGil Shin | 2013-01-08 |
| 8350368 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | HeeJo Chi, HanGil Shin | 2013-01-08 |
| 8318539 | Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects | HeeJo Chi, HanGil Shin | 2012-11-27 |
| 8318541 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | HanGil Shin, HeeJo Chi | 2012-11-27 |
| 8314486 | Integrated circuit packaging system with shield and method of manufacture thereof | HeeJo Chi, HyungSang Park | 2012-11-20 |
| 8288209 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | HeeJo Chi, HanGil Shin | 2012-10-16 |
| 8264091 | Integrated circuit packaging system with encapsulated via and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2012-09-11 |
| 8202797 | Integrated circuit system with recessed through silicon via pads and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2012-06-19 |
| 8143097 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | HeeJo Chi, HanGil Shin | 2012-03-27 |
| 8138014 | Method of forming thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, HanGil Shin | 2012-03-20 |
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Ki Youn Jang, HeeJo Chi | 2011-10-11 |
| 8022538 | Base package system for integrated circuit package stacking and method of manufacture thereof | WonJun Ko | 2011-09-20 |
| 8018034 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | HeeJo Chi, HanGil Shin | 2011-09-13 |
| 7928552 | Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2011-04-19 |
| 7863735 | Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2011-01-04 |