Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665662 | Semiconductor device and method of forming substrate including embedded component with symmetrical structure | JinHee Jung, Sungsoo Kim | 2020-05-26 |
| 10236337 | Semiconductor device and method of forming substrate including embedded component with symmetrical structure | JinHee Jung, Sungsoo Kim | 2019-03-19 |
| 9837484 | Semiconductor device and method of forming substrate including embedded component with symmetrical structure | JinHee Jung, Sungsoo Kim | 2017-12-05 |
| 9324659 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | SungWon Cho, DaeSik Choi, DongSoo Moon | 2016-04-26 |
| 9210816 | Method of manufacture of support system with fine pitch | YoungDal Roh, KyoungHee Park, Dong Ju Jeon | 2015-12-08 |
| 8592973 | Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof | DeokKyung Yang, DaeSik Choi | 2013-11-26 |
| 8569869 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | A Leam Choi, JoHyun Bae | 2013-10-29 |
| 8314486 | Integrated circuit packaging system with shield and method of manufacture thereof | HeeJo Chi, NamJu Cho | 2012-11-20 |
| 8102666 | Integrated circuit package system | In Sang Yoon, DeokKyung Yang, Soo-San Park | 2012-01-24 |
| 8093100 | Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof | A Leam Choi, Jae Han Chung, DeokKyung Yang | 2012-01-10 |
| 7859099 | Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof | A Leam Choi, Jae Han Chung, DeokKyung Yang | 2010-12-28 |
| 7607727 | Armrest locking device | — | 2009-10-27 |