| 8970044 |
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof |
DongSam Park, Yongduk Lee |
2015-03-03 |
| 8699232 |
Integrated circuit packaging system with interposer and method of manufacture thereof |
DeokKyung Yang, JoHyun Bae |
2014-04-15 |
| 8569869 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof |
HyungSang Park, JoHyun Bae |
2013-10-29 |
| 8558366 |
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof |
Kenny Lee, In Sang Yoon, HanGil Shin |
2013-10-15 |
| 8183089 |
Method for manufacturing package system incorporating flip-chip assembly |
Young Jin Woo, Junwoo Myung |
2012-05-22 |
| 8106498 |
Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof |
HanGil Shin, HeeJo Chi |
2012-01-31 |
| 8093100 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof |
Jae Han Chung, DeokKyung Yang, HyungSang Park |
2012-01-10 |
| 8080446 |
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof |
Kenny Lee, In Sang Yoon, HanGil Shin |
2011-12-20 |
| 8008787 |
Integrated circuit package system with delamination prevention structure |
DongSam Park, Keon Teak Kang |
2011-08-30 |
| 7859099 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof |
Jae Han Chung, DeokKyung Yang, HyungSang Park |
2010-12-28 |
| 7859120 |
Package system incorporating a flip-chip assembly |
Young Jin Woo, Junwoo Myung |
2010-12-28 |