Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107028 | Thermally enhanced FCBGA package | KyungOe Kim, Wagno Alves Braganca, JR. | 2024-10-01 |
| 11823973 | Package with compartmentalized lid for heat spreader and EMI shield | KyungOe Kim, Woojin Lee | 2023-11-21 |
| 11670563 | Thermally enhanced FCBGA package | KyungOe Kim, Wagno Alves Braganca, JR. | 2023-06-06 |
| 9087701 | Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP | Yongduk Lee | 2015-07-21 |
| 8970044 | Integrated circuit packaging system with vertical interconnects and method of manufacture thereof | A Leam Choi, Yongduk Lee | 2015-03-03 |
| 8883561 | Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP | Yongduk Lee | 2014-11-11 |
| 8704365 | Integrated circuit packaging system having a cavity | Dongjin Jung | 2014-04-22 |
| 8598034 | Package-on-package system with through vias and method of manufacture thereof | JoungIn Yang | 2013-12-03 |
| 8460968 | Integrated circuit packaging system with post and method of manufacture thereof | HanGil Shin, HeeJo Chi | 2013-06-11 |
| 8367465 | Integrated circuit package on package system | Choong Bin Yim, In Sang Yoon | 2013-02-05 |
| 8334601 | Package-on-package system with through vias and method of manufacture thereof | Joungln Yang | 2012-12-18 |
| 8110905 | Integrated circuit packaging system with leadframe interposer and method of manufacture thereof | YoungSik Cho, Sang Ho Lee | 2012-02-07 |
| 8008787 | Integrated circuit package system with delamination prevention structure | A Leam Choi, Keon Teak Kang | 2011-08-30 |
| 7989950 | Integrated circuit packaging system having a cavity | Dongjin Jung | 2011-08-02 |
| 7986048 | Package-on-package system with through vias and method of manufacture thereof | JoungIn Yang | 2011-07-26 |
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Joungln Yang, Dongjin Jung | 2011-01-04 |
| 7482203 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Seongmin Lee, Jaehyun LIM, JoungIn Yang | 2009-01-27 |
| 7312519 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Seongmin Lee, Jaehyun LIM, JoungIn Yang | 2007-12-25 |
| 7298037 | Stacked integrated circuit package-in-package system with recessed spacer | Choong Bin Yim, Sungmin Song, Seongmin Lee, Jaehyun LIM, JoungIn Yang | 2007-11-20 |