Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476775 | Integrated circuit packaging system with embedded interconnect and method of manufacture thereof | JoungIn Yang, Sunghyun Lee | 2013-07-02 |
| 8110905 | Integrated circuit packaging system with leadframe interposer and method of manufacture thereof | DongSam Park, Sang Ho Lee | 2012-02-07 |
| 7804166 | Integrated circuit package system with stacking module | JoungIn Yang, Nam Ju Cho | 2010-09-28 |