Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008787 | Integrated circuit package system with delamination prevention structure | DongSam Park, A Leam Choi | 2011-08-30 |
| 7445962 | Stacked integrated circuits package system with dense routability and high thermal conductivity | Bongsuk Choi, Jae Han Chung | 2008-11-04 |