Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272877 | Electronic device including antenna | Minchang Shim, Soli JUNG | 2025-04-08 |
| 12108552 | Electronic device including flexible display | Joongyeon CHO, Taekyung LEE, Gisoo LIM, Byunghun Cho, Jongchul Choi +1 more | 2024-10-01 |
| 11611141 | Housing, manufacturing method thereof, and electronic device having the housing | Kwonho SON, Sangin Baek, Gyeongtae KIM, Minsung Lee | 2023-03-21 |
| 11553614 | Electronic device including flexible display | Joongyeon CHO, Taekyung LEE, Gisoo LIM, Byunghun Cho, Jongchul Choi +1 more | 2023-01-10 |
| 11528353 | Electronic device including fingerprint sensor | Sungjoo Cho, Daeyoung NOH, Jongchul Choi | 2022-12-13 |
| 11470191 | Electronic device including rotating optical module | Minsu Jung, Chulho Bae | 2022-10-11 |
| 10665924 | Housing, manufacturing method thereof, and electronic device having the housing | Kwonho SON, Sangin Baek, Gyeongtae KIM, Minsung Lee | 2020-05-26 |
| 10051096 | Battery pack mounting structure and electronic device having the same | Sangin Baek, Gyeongtae KIM, Heecheul MOON, Minsung Lee | 2018-08-14 |
| 9578759 | Electronic device with cover | Jaeil Seo, Gyeongtae KIM, Kyungpil KIM, Heecheul MOON, Sangin Baek +3 more | 2017-02-21 |
| 8709934 | Electronic system with vertical intermetallic compound | BaeYong Kim, Oh Han Kim | 2014-04-29 |
| 8012867 | Wafer level chip scale package system | Koo Hong Lee, Il Kwon Shim, Young Cheol Kim | 2011-09-06 |
| 7445962 | Stacked integrated circuits package system with dense routability and high thermal conductivity | Jae Han Chung, Keon Teak Kang | 2008-11-04 |