YK

Young Cheol Kim

SC Stats Chippac: 10 patents #83 of 425Top 20%
KM Korea Institute Of Machinery & Materials: 4 patents #72 of 729Top 10%
Samsung: 3 patents #30,683 of 75,807Top 45%
HC Halla Climate Control: 1 patents #95 of 254Top 40%
KC Keyang Electric Machinery Co.: 1 patents #21 of 40Top 55%
FC Fastech Co.: 1 patents #2 of 13Top 20%
KC Kumho & Co.: 1 patents #14 of 27Top 55%
AD Agency For Defense Development: 1 patents #243 of 991Top 25%
University Of Texas System: 1 patents #2,951 of 6,559Top 45%
Apple: 1 patents #12,251 of 18,612Top 70%
Overall (All Time): #161,709 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11637476 Elastic bush and motor using same Hoe Cheon Kim 2023-04-25
11129741 Passive ankle assist apparatus with torsional coil spring Gwang Tae Kim, Tae Woo Park, Young-June Shin, Man Bok Hong, Byoung Ju Lee 2021-09-28
10906192 Gripper Jae Won Eom, Yong Heum Na, Jae Woo Lee 2021-02-02
9784471 Cartridge-type inline heater and system for controlling working fluid temperature using the same Jung-Ho Lee, Kong Hoon Lee, Seok Ho Yoon 2017-10-10
9012614 Rapid nucleic acid purification using paper chromatography Minsu KO, Siseok Lee 2015-04-21
8710675 Integrated circuit package system with bonding lands Koo Hong Lee 2014-04-29
8568588 Apparatus for osmotic power generation and desalination using salinity difference Yu Chang Kim, Sang Jin Park, In Seob PARK, Byung-Ik Choi, Kong Hoon Lee 2013-10-29
8530280 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof Choong Bin Yim 2013-09-10
8500331 Hybrid air foil bearing and method of manufacture Daejong Kim, An Sung Lee 2013-08-06
8471374 Integrated circuit package system with L-shaped leadfingers Koo Hong Lee, Jae Hak Yee 2013-06-25
8067272 Integrated circuit package system for package stacking and manufacturing method thereof Koo Hong Lee, Jae Hak Yee, II Kwon Shim 2011-11-29
8012867 Wafer level chip scale package system Koo Hong Lee, Il Kwon Shim, Bongsuk Choi 2011-09-06
7985623 Integrated circuit package system with contoured encapsulation Choong Bin Yim 2011-07-26
7915738 Stackable multi-chip package system with support structure Koo Hong Lee, Jae Hak Yee 2011-03-29
7856841 Air conditioning system for automobile Yong Sik Kim 2010-12-28
7861059 Method for testing and programming memory devices and system for same Paul Magliocco, Richard Greene, John M. Holmes 2010-12-28
7683467 Integrated circuit package system employing structural support Byoung Wook Jang, Koo Hong Lee 2010-03-23
7645638 Stackable multi-chip package system with support structure Koo Hong Lee, Jae Hak Yee 2010-01-12
7622333 Integrated circuit package system for package stacking and manufacturing method thereof Koo Hong Lee, Jae Hak Yee, Il Kwon Shim 2009-11-24
7435211 Ball balancer for vertical rotor and centrifuge An Sung Lee, Byung Ok Kim 2008-10-14
7297759 Peptides for increasing transfection efficiency Jong-Gu Park, Ik-Jae Moon 2007-11-20
6149420 Mold with indicia forming changeable core Kwan S. Kim 2000-11-21
5616194 Pneumatic radial tire having a tread pattern Nack-Hyun Lim, Bong-Wha Kim 1997-04-01
5315601 Error correction method and apparatus thereof Man-Young Lee, Hak-song Park, Tae-Yong Kim, Yong Jin Choi, Jae-moon Kim 1994-05-24
5012451 ROM circuit Hyeong-keun An, Seok-jeong Lee, Jung Jae Yu 1991-04-30