Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709934 | Electronic system with vertical intermetallic compound | Bongsuk Choi, Oh Han Kim | 2014-04-29 |
| 8633586 | Mock bump system for flip chip integrated circuits | Oh Han Kim, Youngmin Kim | 2014-01-21 |
| 8624402 | Mock bump system for flip chip integrated circuits | Youngmin Kim, Hyunchul Kang | 2014-01-07 |