Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723310 | Integrated circuit packaging system having warpage prevention structures | YiSu Park, KyungHoon Lee, SangMi Park, DaeSik Choi | 2014-05-13 |
| 8334601 | Package-on-package system with through vias and method of manufacture thereof | DongSam Park | 2012-12-18 |
| 7863100 | Integrated circuit packaging system with layered packaging and method of manufacture thereof | Dongjin Jung, DongSam Park | 2011-01-04 |