| 10735390 |
Method for authentication and electronic device supporting the same |
Jaehwan Kim, Junghun KIM, Jinwoo Lee, Yongjoon Jeon, Bokun CHOI +3 more |
2020-08-04 |
| 10665534 |
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package |
KyungHoon Lee, KyoungIl Huh, DaeSik Choi |
2020-05-26 |
| 9872176 |
Method for processing authentication, electronic device and server for supporting the same |
Junghun KIM, Jaehwan Kim, Yongseok Park, Jisup Lee |
2018-01-16 |
| 9799590 |
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package |
KyungHoon Lee, KyoungIl Huh, DaeSik Choi |
2017-10-24 |
| 9794606 |
Transmission of digital content to select devices |
Hyunho Park, Jupyo Hong |
2017-10-17 |
| 9318380 |
Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant |
Youngjoon KIM, YongHyuk Jeong |
2016-04-19 |
| 8816404 |
Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant |
Youngjoon KIM, YongHyuk Jeong |
2014-08-26 |
| 8723310 |
Integrated circuit packaging system having warpage prevention structures |
YiSu Park, KyungHoon Lee, Joungln Yang, DaeSik Choi |
2014-05-13 |
| 8679900 |
Integrated circuit packaging system with heat conduction and method of manufacture thereof |
DaeSik Choi, Minjung Kim, MinWook Yu |
2014-03-25 |
| 8466567 |
Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
DaeSik Choi, Oh Han Kim |
2013-06-18 |
| 8372695 |
Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
Minjung Kim |
2013-02-12 |
