Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281228 | Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die | DaeSik Choi, JoungIn Yang, Minjung Kim, Sang Mi Park | 2016-03-08 |
| 8703535 | Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof | Minjung Kim, DaeSik Choi, YiSu Park | 2014-04-22 |
| 8679900 | Integrated circuit packaging system with heat conduction and method of manufacture thereof | DaeSik Choi, SangMi Park, Minjung Kim | 2014-03-25 |