Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281274 | Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof | Xing Zhao, Chang Bum Yong, Duk Ju Na, Ling Ji | 2016-03-08 |
| 7443039 | System for different bond pads in an integrated circuit package | Lun Zhao, Wan Lay Looi, Yonggang Jin, Jae Yong SONG, Won Sun Shin | 2008-10-28 |
| 7005370 | Method of manufacturing different bond pads on the same substrate of an integrated circuit package | Lun Zhao, Wan Lay Looi, Yonggang Jin, Jae Yong SONG, Won Sun Shin | 2006-02-28 |