LZ

Lun Zhao

Globalfoundries: 8 patents #444 of 4,424Top 15%
SS St Assembly Test Services: 2 patents #21 of 63Top 35%
TT Taiyuan University Of Science And Technology: 1 patents #32 of 96Top 35%
📍 Ballston Lake, NY: #76 of 321 inventorsTop 25%
🗺 New York: #12,360 of 115,490 inventorsTop 15%
Overall (All Time): #407,266 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11673173 Special roller machine for metal polar plate Fuqiang Zhao, Hugang Tian, Qingxue Huang, Hongquan Dong, Xiaodong Zhang 2023-06-13
9955221 Device and method for film distribution and watching Xuebo Zhao 2018-04-24
9607989 Forming self-aligned NiSi placement with improved performance and yield Xusheng Wu, Yue Hu, Xin-Yong WANG, Yong Meng Lee, Wen-Pin Peng +1 more 2017-03-28
9570586 Fabrication methods facilitating integration of different device architectures Hong Yu, Seong Yeol Mun, Bingwu Liu, Richard J. Carter, Manfred Eller 2017-02-14
9455198 Methods of removing fins so as to form isolation structures on products that include FinFET semiconductor devices Hong Yu, Hongliang Shen, Zhenyu Hu, Richard J. Carter, Xusheng Wu 2016-09-27
9324713 Eliminating field oxide loss prior to FinFET source/drain epitaxial growth Hong Yu, Bingwu Liu, Hui Zang 2016-04-26
9147696 Devices and methods of forming finFETs with self aligned fin formation Jing Wan, Andy Wei, Dae Geun Yang, Jin Ping Liu, Tien Ying Luo +3 more 2015-09-29
9093561 Modified, etch-resistant gate structure(s) facilitating circuit fabrication Hong Yu, Huang Liu, Richard J. Carter 2015-07-28
9024368 Fin-type transistor structures with extended embedded stress elements and fabrication methods Hong Yu, Hyucksoo Yang, Bingwu Liu, Puneet Khanna 2015-05-05
8815699 Fabrication of reverse shallow trench isolation structures with super-steep retrograde wells Tong Weihua, Krishnan Bharat, Kim Seung, Lee Yongmeng, Kim Sun 2014-08-26
7443039 System for different bond pads in an integrated circuit package Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG, Won Sun Shin 2008-10-28
7005370 Method of manufacturing different bond pads on the same substrate of an integrated circuit package Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG, Won Sun Shin 2006-02-28