Wan Lay Looi has been granted 5 US patents while listed as an inventor at Stats Chippac . The first was granted in 2006 and the most recent in March 2012. Wan Lay Looi ranks #907,971 of 4,157,543 US inventors in our database (top 21.8%). Patent records list Wan Lay Looi in Kota Tinggi, MY.
Patents per Year Patents granted per year, 2006 to 2012 Bar chart with a peak of 2 patents in 2008. peak 2 2006: 1 patents 2006 2008: 2 patents 2008 2011: 1 patents 2011 2012: 1 patents 2012
Issued Patents All Time
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Showing 1–5 of 5 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
8134196 Integrated circuit system with metal-insulator-metal circuit element Yaojian Lin , Haijing Cao , Eng Seng Lim 2012-03-13
8008770 Integrated circuit package system with bump pad Yaojian Lin , Romeo Emmanuel P. Alvarez , Haijing Cao 2011-08-30
7443039 System for different bond pads in an integrated circuit package Lun Zhao , Kyaw Oo Aung , Yonggang Jin , Jae Yong SONG , Won Sun Shin 2008-10-28
7381634 Integrated circuit system for bonding Yaojian Lin , Byung Tai Do , Haijing Cao 2008-06-03
7005370 Method of manufacturing different bond pads on the same substrate of an integrated circuit package Lun Zhao , Kyaw Oo Aung , Yonggang Jin , Jae Yong SONG , Won Sun Shin 2006-02-28
$1,531,000