Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Arvind Sundarrajan | 2025-07-29 |
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Arvind Sundarrajan | 2023-12-26 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Arvind Sundarrajan | 2022-08-02 |
| 9837336 | Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief | Won Kyoung Choi, Jae Hun Ku | 2017-12-05 |
| 9728415 | Semiconductor device and method of wafer thinning involving edge trimming and CMP | Vinoth Kanna Chockanathan, Xing Zhao, Duk Ju Na | 2017-08-08 |
| 9281274 | Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof | Xing Zhao, Duk Ju Na, Kyaw Oo Aung, Ling Ji | 2016-03-08 |
| 8809191 | Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer | Won Kyoung Choi, Jae Hun Ku | 2014-08-19 |
| 8742591 | Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief | Won Kyoung Choi, Jae Hun Ku | 2014-06-03 |